Update actions products

doc/gen/README.md

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+# PCB
+
+Board size: 49.8x39.64 mm (1.96x1.56 inches)
+
+- This is the size of the rectangle that contains the board
+- Thickness: 1.6 mm (63 mils)
+- Material: FR4
+- Finish: None
+- Layers: 4
+- Copper thickness: 35 µm
+
+Solder mask: TOP / BOTTOM
+
+- Color: Green
+
+Silk screen: TOP / BOTTOM
+
+- Color: White
+
+
+Stackup:
+
+| Name                 | Type                 | Color            | Thickness [µm]| Material        | Er        | Loss tan     |
+|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
+| F.SilkS              | Top Silk Screen      |                  |               |                 |           |              |
+| F.Paste              | Top Solder Paste     |                  |               |                 |           |              |
+| F.Mask               | Top Solder Mask      |                  |            10 |                 |           |              |
+| F.Cu                 | copper               |                  |            35 |                 |           |              |
+| dielectric 1         | prepreg              |                  |           100 | FR4             |       4.5 |        0.020 |
+| In1.Cu               | copper               |                  |            35 |                 |           |              |
+| dielectric 2         | core                 |                  |          1240 | FR4             |       4.5 |        0.020 |
+| In2.Cu               | copper               |                  |            35 |                 |           |              |
+| dielectric 3         | prepreg              |                  |           100 | FR4             |       4.5 |        0.020 |
+| B.Cu                 | copper               |                  |            35 |                 |           |              |
+| B.Mask               | Bottom Solder Mask   |                  |            10 |                 |           |              |
+| B.Paste              | Bottom Solder Paste  |                  |               |                 |           |              |
+| B.SilkS              | Bottom Silk Screen   |                  |               |                 |           |              |
+
+# Important sizes
+
+Clearance: 0.2 mm (8 mils)
+
+Track width: 0.2 mm (8 mils)
+
+- By design rules: 0.0 mm (0 mils)
+
+Drill: 0.4 mm (16 mils)
+
+- Vias: 0.4 mm (16 mils) [Design: 0.4 mm (16 mils)]
+- Pads: 3.3 mm (130 mils)
+- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
+
+Via: 0.6/0.3 mm (24/12 mils)
+
+- By design rules: 0.5/0.3 mm (20/12 mils)
+- Micro via: yes [0.2/0.1 mm (8/4 mils)]
+- Buried/blind via: yes
+- Total: 178 (thru: 178 buried/blind: 0 micro: 0)
+
+Outer Annular Ring: 0.1 mm (4 mils)
+
+- By design rules: 1.15 mm (45 mils)
+
+Eurocircuits class: 6C
+- Using min drill 0.35 mm for an OAR of 0.13 mm
+
+
+# General stats
+
+Components count: (SMD/THT)
+
+- Top: 3/0 (SMD)
+- Bottom: 19/0 (SMD)
+
+Defined tracks:
+
+- 0.3 mm (12 mils)
+- 0.5 mm (20 mils)
+
+Used tracks:
+
+- 0.2 mm (8 mils) (2) defined: no
+- 0.3 mm (12 mils) (112) defined: yes
+- 0.5 mm (20 mils) (23) defined: yes
+
+Defined vias:
+
+
+Used vias:
+
+- 0.6/0.3 mm (24/12 mils) (Count: 178, Aspect: 2.7 A) defined: no
+
+Holes (excluding vias):
+
+- 3.2 mm (126 mils) (4)
+
+Oval holes:
+
+
+Drill tools (including vias and computing adjusts and rounding):
+
+- 0.4 mm (16 mils) (178)
+- 3.3 mm (130 mils) (4)
+
+Solder paste stats:
+
+Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³
+and 1.0 g/cm³ for the flux. This paste has an specific gravity of  4.15 g/cm³.
+
+The stencil thickness is  0.12 mm.
+
+| Side   | Pads with paste | Area [mm²] | Paste [g] |
+|--------|-----------------|------------|-----------|
+| Top    |              35 |      36.60 |      0.18 |
+| Bottom |              51 |      67.67 |      0.34 |
+| Total  |              86 |     104.26 |      0.52 |
+
+Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.
+
+
+